جديد محطة اللحام KOKI TEC ULTIMA

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Marke: KOKI TEC
Manufacturer
KOKI TEC
Series
ULTIMA (TakuROBO Benchtop Type)
CE Mark
Registered on all three units
System comprises
ULTIMA-TRZ + ULTIMA-SPZ + ULTIMA-PHS
Suitable for
Prototype to small and medium volume PCB production
ULTIMA-TRZ Selective Soldering Machine
Dimensions (without signal tower): 940 (L) x 885 (W) x 540 (H) mm
Outer dimensions (with signal tower): 940 (L) x 885 (W) x 753 (H) mm
Body dimensions: W620 x L940 x H442 mm
Minimum PCB size: 50 (W) x 50 (L) mm
Maximum PCB size: 250 (W) x 330 (L) mm
PCB thickness: 0.8 to 2.0 mm
Machine weight: approx. 120 kg
Power source: single-phase AC 200V plus/minus 5 percent
4 kVA
Nitrogen supply: purity 99.99 percent or more
0.4 to 0.5 MPa
25 L/min
Solder pot capacity: approx. 16 kg (specific gravity 7.3)
Nozzle range: 17 sizes from diameter 2 to diameter 20 mm inner diameter
including Aerojet
Standard nozzles available: diameter 2.5
3
4
5
6
7
8
9
10
12
14
16
20 mm
Superfine nozzles available: diameter 2
2.5
3
4 mm
Jet wave accuracy: plus/minus 0.3 mm or less
Normal solder temperature: 230 to 330 degrees C
Nitrogen heating temperature: 350 degrees C plus/minus 10 percent
Moving part: PCB table (X-Y-Z axes)
Soldering modes: Line mode and Point model
ULTIMA-SPZ Spray Fluxer
Dimensions (without signal tower): 630 (L) x 912 (W) x 390 (H) mm
Outer dimensions (with signal tower): 630 (L) x 912 (W) x 862 (H) mm
Body dimensions: W630 x L910 x H390 mm
Minimum PCB size: 50 (W) x 50 (L) mm
Maximum PCB size: 250 (W) x 330 (L) mm
PCB thickness: 0.8 to 2.0 mm
Machine weight: approx. 60 kg
Power source: single-phase AC 100 to 240V plus/minus 10 percent
0.2 kVA
Air supply: 0.4 to 0.5 MPa
Flux tank capacity: 0.3 to 0.4 litres
Fluxer type: Two-fluid Aerojet nozzle
Moving part: Spray gun (X-Y axes)
ULTIMA-PHS Preheating Machine
Dimensions (without signal tower): 690 (L) x 602 (W) x 682 (H) mm
Outer dimensions (with signal tower): 690 (L) x 602 (W) x 901 (H) mm
Body dimensions: W600 x L602 x H682 mm
Minimum PCB size: 50 (W) x 50 (L) mm
Maximum PCB size: 250 (W) x 330 (L) mm
PCB thickness: 0.8 to 2.0 mm
Machine weight: approx. 45 kg
Power source: single-phase AC 200V plus/minus 10 percent
2.4 kVA
Temperature setting range: 0 to 400 degrees C
Key Features
Stable soldering quality replacing manual hand soldering
Small footprint — suitable for cell production environments
Available from prototype production through to small and medium volume runs
Aero jet nozzle for precise and clean flux application
N2 nitrogen heating for anti-oxidation of solder and land
and improved solder fluidity
Diagonal PCB lift movement prevents solder bridge generation
Up to 3 solder pots can be added to increase production volume
Energy-saving and carbon-neutral compatible design
Applicable to heavy soldering with special nozzles
Productivity advantage over manual soldering: 1,500 pcs/day vs 1,300 pcs/day manual
Operator reduction: 2 persons vs 6 persons manual
Significant solder material savings: 4 kg vs 18 kg per day manual
Available Options
Program creation system Freedom (separate PC required)
Data creation supporting software (scanner and Gerber data NC creation)
Production log management application
Parts library management application
Application for multi-communication (up to 3 TRZ units and 1 SPZ)
Barcode and QR code automatic PCB model switching application
Three-light signal tower
Weekly timer for automated machine startup
Superfine nozzles
Laser-type wave height detection and feedback control
Sensors for solder overheat and N2 overheat
PCB detection and error-proof functions
PCB presence sensor
Flux flowmeter
Robot I/O
Aluminium frame stand
Adaptive voltage and step-down transformer
Automatic solder feeder (diameter 2 mm solder wire
1 kg bobbin)
Safety cover with exhaust duct (open type
open/close type
or with area sensor)
Board size expansion option: X axis extended from 330 mm to 400 mm
Soldering verification camera with LED lighting
Centre bar anti-warp mechanism
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